Epoxy Resin L + Hardener GL 1 (30 minutes), set of two components
- Low viscosity (820 mPas at 25 °C)
- Fully cures at 10 °C
- Glass transition temperature (Tg) > 80 °C (post-curing at 70 °C / 15 h)
- Ambient curing does not result in brittleness (at 20 °C)
- High static and dynamic strength
Epoxy Resin L with Hardener GL 1 is a frequently used laminating resin system from the R&G delivery program. Due to its low surface tension, good adhesion and low curing shrinkage, it is also very suitable for bonding wood, metal and PS rigid foams such as Styropor®. It is ideal for impregnating glass, aramid and carbon fibers and offers a very good price/performance ratio.
Approval by the Germanische Lloyd for the construction of boats and rotor blades for wind turbines.
Processing time: approx. 30 minutes
Mixing ratio:
100 : 30 parts by weight Epoxy Resin L : Hardener GL 1
100 : 35 parts by volume Epoxy Resin L : Hardener GL 1
Processing times with Epoxy Resin L depending on the proportion of hardener GL 1 / GL 2*:
Approx. pot life in minutes (100 g at 23 °C with Epoxy Resin L)
|
Quantity of Hardener GL 1 in %
|
Quantity of Hardener GL 2 in %
|
210 |
0 |
100 |
150 |
10 |
90 |
125 |
20 |
80 |
100 |
30 |
70 |
85 |
40 |
60 |
60 |
50 |
50 |
50 |
60 |
40 |
43 |
70 |
30 |
38 |
80 |
20 |
34 |
90 |
10 |
30 |
100 |
0 |
*Both hardeners can be mixed as required. The mixing ratio of 100: 30 resin to hardener remains unchanged.
Overview of charactericstics of Epoxy Resin L + Hardener GL 1:
|
Norm |
Unit |
Result |
Requirement GL |
Density |
DIN EN ISO 1183-1 |
g/cm³ |
1.171 |
- |
Flexural strength |
DIN EN ISO 178 |
MPa |
135 |
≥ 100 |
Tensile modulus |
DIN EN ISO 527-2 |
MPa |
3490 |
≥ 2700 |
Tensile strength |
DIN EN ISO 527-2 |
MPa |
74 |
≥ 55 |
Elongation at break |
DIN EN ISO 527-2 |
% |
3.5 |
≥ 2.5 |
Heat deflection temperature (HDT)* |
DIN EN ISO 75-2 |
°C |
74 |
≥ 70 |
Water resumption (after 168 h) |
according to DIN EN ISO 175 |
mg |
31 |
≤ 50 |
*24 h at 23 °C + 16 h at 80 °C
Suitable for the following processing methods:
- Resin infusion (RI)
- RTM (resin transfer moulding)
- Press moulding
- Vacuum moulding
- Filament winding
- Hand laminating
The resin component itself is absolutely free of crystallization due to its Bisphenol A/F base! The resin system is ambient curing and develops no distinctive brittleness even at curing temperatures below 20 °C. We however recommend, to improve the mechanical and physical properties, to perform a post-curing at least at 40 °C over 15 h.
More info see eWiki.
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