- Processing time (100 g formulation at 25 °C): approx. 60 minutes
100 : 63 parts by weight resin to hardener
100 : 71 parts by volume resin to hardener
Curing time at room temperature: approx. 24 hours
Delivered state: Liquid
Viscosity at 25 °C: 500 ± 100 mPa.s
Active H equivalent: 112 g/equiv.
Gardner colour index: < 3
Density at 20 °C: 1.02 ± 0.02 g/cm3
Refractive index at 25 °C: 1.530 ± 0.002
Hardener EPH 500 is used in combination with liquid epoxy resins, primarily in solvent-free varnishes, coatings and laminating resin. The resulting surfaces are tack-free and largely resistant to light and colour-fast. Owing to its low viscosity and long pot life this hardener is suitable for formulating sprayable systems that can be processed in single-constituent airless installations. Curing at 5 °C possible.
Shelf life Hardener EPH 500
One year in sealed packaging at room temperature.
Expertise for the resin system Epoxy Resin L + Hardener EPH 500: the system is not cytotoxic (cell damaging), important for applications in medical purposes!
General information about the system "Epoxy Resin L" with Hardeners S, L, CL, EPH 500, EPH 161, W 300, GL 1 and GL 2
- Low viscosity, free of solvents and fillers
- Fast impregnation of glass, aramid, carbon and natural fibres
- High static and dynamic strength (GL approval with the Hardeners GL 1 and GL 2 being present
Epoxy Resin L with the corresponding Hardeners S, L, CL, EPH 500, EPH 161, W 300, GL 1 and GL 2 is the most commonly used laminating and adhesive resin in R&G`s delivery programme.
In conjunction with the Hardeners S (15 minutes), L (40 minutes), CL (60 minutes), EPH 500 (60 minutes), EPH 161 (90 minutes), W 300 (300 minutes), GL 1 (30 minutes) and GL 2 (210 minutes), this epoxy resin exhibits similar mechanical properties to those of the laminating systems usual aerospace .Its heat deflection temperature reaches from 60 °C (S, L, EPH 500, W 300), to 80 °C (GL 1 and GL 2, after post-curing), to 95 °C (CL, after post-curing) and finally to 120 °C (EPH 161, after post-curing).
Its low surface tension, good adhesion, and minimal curing shrinkage makes the Epoxy Resin L ideal for bonding wood, metal, foamed polystyrene like Styropor® etc. It can be processed in all of the customary methods, e.g. hand lay-up, pressure and vacuum impregnation, press moulding and filament winding.
Pictures of application: eWiki (translator included)
More info see eWiki.
all Prices price incl. VAT, possibly plus shipping